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Kandou to Demonstrate Glasswing SerDes at Chiplet Summit

Kandou to Demonstrate Glasswing SerDes at Chiplet Summit
IP Optimized for High-Speed, Ultra-Low Power Chiplet Interconnects SAINT-SULPICE, Switzerland, Jan. 18, 2023 (GLOBE NEWSWIRE) — Who: Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link intellectual property (IP) solutions that improve the way the world connects and communicates What: Will demonstrate Glasswing™ chip-to-chip link intellectual property (IP) optimized for high-speed, ultra-low power ultra-short (USR) SerDes […] The post Kandou to Demonstrate Glasswing Ser... Read More
Posted: Jan 18 2023, 16:55
Author Name: forextv
Views: 102475

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